PIC16F7X7
DS30498C-page 48
2004 Microchip Technology Inc.
4.7.4
EXITING SLEEP WITH AN
INTERRUPT
Any interrupt, such as WDT or INT0, will cause the part
to leave the Sleep mode.
The SCS bits are unaffected by a SLEEP command and
are the same before and after entering and leaving
Sleep. The clock source used after an exit from Sleep
is determined by the SCS bits.
4.7.4.1
Sequence of Events
If SCS<1:0> = 00:
1.
The device is held in Sleep until the CPU start-up
time-out is complete.
2.
If the primary system clock is configured as an
external oscillator (HS, XT, LP), then the OST will
be active waiting for 1024 clocks of the primary
system clock. While waiting for the OST, the
device will be held in Sleep unless Two-Speed
Start-up is enabled. The OST and CPU start-up
timers run in parallel. Refer to Section 15.17.3
on Two-Speed Start-up.
3.
After both the CPU start-up timer and the
Oscillator Start-up Timer have timed out, the
device will exit Sleep and begin instruction
execution with the primary clock defined by the
FOSC bits.
If SCS<1:0> = 01 or 10:
1.
The device is held in Sleep until the CPU start-up
time-out is complete.
2.
After the CPU start-up timer has timed out, the
device will exit Sleep and begin instruction
execution with the selected oscillator mode.
Note:
If a user changes SCS<1:0> just before
entering Sleep mode, the system clock
used when exiting Sleep mode could be
different than the system clock used when
entering Sleep mode.
As an example, if SCS<1:0> = 01, T1OSC
is the system clock and the following
instructions are executed:
BCF
OSCCON,SCS0
SLEEP
then a clock change event is executed. If
the primary oscillator is XT, LP or HS, the
core will continue to run off T1OSC and
execute the SLEEP command.
When Sleep is exited, the part will resume
operation with the primary oscillator after
the OST has expired.
相关PDF资料
PIC18F86K22-I/PTRSL MCU PIC 64K FLASH XLP 80TQFP
PIC16C63A-04I/SP IC MCU OTP 4KX14 PWM 28DIP
PIC16C63A-04I/SO IC MCU OTP 4KX14 PWM 28SOIC
52559-2270 CONN FFC 22POS .5MM VERT ZIF SMD
52559-1870 CONN FFC 18POS .5MM VERT ZIF SMD
DSPIC33EP64MC506-I/PT IC DSC 16BIT 64KB FLASH 64TQFP
52745-1896 CONN FFC 18POS .5MM R/A ZIF SMD
PIC16LC622-04/P IC MCU OTP 2KX14 COMP 18DIP
相关代理商/技术参数
PIC16F737-I/SP 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16F737 SDIL28
PIC16F737-I/SS 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/ML 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/SO 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/SS 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/ML 功能描述:8位微控制器 -MCU 7 KB 368 RAM 25I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/SO 功能描述:8位微控制器 -MCU 7KB 192 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/SP 功能描述:8位微控制器 -MCU 7KB 192 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT